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Dr.-Ing. Gerald Gold, Akad. Rat

Forschungsschwerpunkte

  • Elektromagnetische Wechselwirkung an nichtidealen Materialübergängen, insbesondere Felder in rauen Metalloberflächen Numerische Feldsimulation
  • 3D-Druck von passiven HF-Komponenten
  • 3D-HF-Aufbau- und Verbindungstechniken
  • Entwurf von temporären HF-Prüfadaptionen, insbesondere mit anisotropen eitelastomeren Automatisierung von HF-Prüfaufgaben

Vita

Scholar profile

Gerald Gold received the Diploma degree in mechatronics and the Dr. Eng. degree from Friedrich-Alexander University Erlangen-Nürnberg (FAU), Erlangen, Germany, in 2009 and 2016, respectively. Since 2010, he is with the the Institute of Microwaves and Photonics, FAU, as a Research Assistant. He became the Group Leader of the Microwave Assembly and Interconnects Group in 2018. His research interests include 3D-printed microwave components, electromagnetic interaction with non-ideal surfaces, and automation of RF-measurements.

Neueste Veröffentlichungen

  • K. Lomakin, S. Herold, D. Simon, M. Sippel, A. Sion, M. Vossiek, K. Helmreich and G. Gold, "3D Printed Slotted Rectangular Hollow Waveguides", in Proceedings of the 2019 IEEE MTT-S International Microwave Symposium, Boston, USA, Juni, 2019.
  • G. Gold, K. Lomakin, K. Helmreich and U. Arz, "High-Frequency Modeling of Coplanar Waveguides Including Surface Roughness", Advances in Radio Science, no. 17, April, 2019.
  • K. Lomakin, D. Simon, M. Sippel, G. Gold, K. Helmreich, E. Seler, Z. Tong and R. Reuter, "3D Printed Slotted Waveguide Array Antenna for Automotive Radar Applications in W-Band", in Proceedings of the 48th European Microwave Conference (EuMW 2018), 2018.
  • K. Lomakin, G. Gold and K. Helmreich, "Analytical Waveguide Model Precisely Predicting Loss and Delay Including Surface Roughness", IEEE Transactions on Microwave Theory and Techniques, 2018.
  • M. Ankenbrand, J. Franke, K. Lomakin, T. Pavlenko, M. Sippel, G. Gold, T. Weidner, D. Weiß and K. Helmreich, "Erzeugung von 3D-Funktionsstrukturen fuer Hochfrequenzanwendungen durch Druckverfahren", PLUS - Produktion von Leiterplatten und Systemen, 2018.