• English

Dr.-Ing. Gerald Gold, Akad. Rat


  • Elektromagnetische Wechselwirkung an nichtidealen Materialübergängen, insbesondere Felder in rauen Metalloberflächen Numerische Feldsimulation
  • 3D-Druck von passiven HF-Komponenten
  • 3D-HF-Aufbau- und Verbindungstechniken
  • Entwurf von temporären HF-Prüfadaptionen, insbesondere mit anisotropen eitelastomeren Automatisierung von HF-Prüfaufgaben


Scholar profile

Gerald Gold received the Diploma degree in mechatronics and the Dr. Eng. degree from Friedrich-Alexander University Erlangen-Nürnberg (FAU), Erlangen, Germany, in 2009 and 2016, respectively. Since 2010, he is with the the Institute of Microwaves and Photonics, FAU, as a Research Assistant. He became the Group Leader of the Microwave Assembly and Interconnects Group in 2018. His research interests include 3D-printed microwave components, electromagnetic interaction with non-ideal surfaces, and automation of RF-measurements.

Neueste Veröffentlichungen

  • K. Lomakin, R. Guschlbauer, F. Osmanlic, Z. Fu, M. Sippel, K. Helmreich, C. Körner, M. Vossiek and G. Gold, "3D Printed Copper Waveguides by Selective Electron Beam Melting Process for E-Band", in Proceedings of the EuMW 2019, Paris, Oktober, 2019.
  • I. Lau, A. Hajian, F. Michler, G. Gold, F. Lurz, U. Schmid, K. Helmreich, R. Weigel and A. Kölpin, "Influence of the PCB Manufacturing Process on the Measurement Error of Planar Relative Permittivity Sensors Up To 100 GHz", IEEE Transactions on Microwave Theory and Techniques, vol. 67, no. 7, pp. 2793-2804, Juli, 2019.
  • K. Lomakin, S. Herold, D. Simon, M. Sippel, A. Sion, M. Vossiek, K. Helmreich and G. Gold, "3D Printed Slotted Rectangular Hollow Waveguides", in Proceedings of the IEEE MTT-S International Microwave Symposium, Boston, USA, Juni, 2019., Boston USA, Juni, 2019.
  • G. Gold, K. Lomakin, K. Helmreich and U. Arz, "High-Frequency Modeling of Coplanar Waveguides Including Surface Roughness", Advances in Radio Science, no. 17, April, 2019.
  • K. Lomakin, S. Herold, L. Ringel, J. Ringel, D. Simon, M. Sippel, A. Sion, M. Vossiek, K. Helmreich and G. Gold, "SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating", IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019.