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Mark Sippel, M. Sc.

Neueste Veröffentlichungen

  • K. Lomakin, R. Guschlbauer, F. Osmanlic, Z. Fu, M. Sippel, K. Helmreich, C. Körner, M. Vossiek and G. Gold, "3D Printed Copper Waveguides by Selective Electron Beam Melting Process for E-Band", in Proceedings of the EuMW 2019, Paris, Oktober, 2019.
  • K. Lomakin, S. Herold, D. Simon, M. Sippel, A. Sion, M. Vossiek, K. Helmreich and G. Gold, "3D Printed Slotted Rectangular Hollow Waveguides", in Proceedings of the IEEE MTT-S International Microwave Symposium, Boston, USA, Juni, 2019., Boston USA, Juni, 2019.
  • K. Lomakin, S. Herold, L. Ringel, J. Ringel, D. Simon, M. Sippel, A. Sion, M. Vossiek, K. Helmreich and G. Gold, "SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating", IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019.
  • K. Lomakin, M. Ankenbrand, M. Sippel, J. Franke, K. Helmreich and G. Gold, "Nanojet 3D Printed Coplanar Waveguides on Flexible Polyimide Substrate up to 24 GHz", in Proceedings of the 1st IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2019), Glasgow, 2019.
  • K. Lomakin, L. Klein, L. Ringel, J. Ringel, M. Sippel, K. Helmreich and G. Gold, "3D Printed E-Band Hybrid Coupler", IEEE Microwave and Wireless Components Letters, 2019.