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Prof. Dr.-Ing. Klaus Helmreich

  • Organisation: Department Elektrotechnik-Elektronik-Informationstechnik (EEI)
  • Abteilung: Professur für Rechnergestützten Schaltungsentwurf (Prof. Dr. Helmreich)
  • Telefonnummer: +49 9131 85-20740
  • E-Mail: klaus.helmreich@fau.de
  • Adresse:
    Wetterkreuz 15
    91058 Erlangen
    Raum 03.003

Vita

Klaus Helmreich received the Diploma degree in physics focused on test and failure analysis of integrated circuits and Dr. Eng. degree from Friedrich-Alexander University Erlangen-Nu ̈rnberg (FAU), Erlangen, Germany, in 1993. He was with industry as a Technology Specialist, where he was involved in mixed-signal test, device interfacing, and signal integrity characterization. Since 2004, he has been a Professor with the Institute of Microwaves and Photonics, FAU. His current research interests include signal integrity, material characterization, and test

Neueste Veröffentlichungen

  • K. Lomakin, S. Herold, D. Simon, M. Sippel, A. Sion, M. Vossiek, K. Helmreich and G. Gold, "3D Printed Slotted Rectangular Hollow Waveguides", in Proceedings of the 2019 IEEE MTT-S International Microwave Symposium, Boston, USA, Juni, 2019.
  • G. Gold, K. Lomakin, K. Helmreich and U. Arz, "High-Frequency Modeling of Coplanar Waveguides Including Surface Roughness", Advances in Radio Science, no. 17, April, 2019.
  • K. Lomakin, T. Pavlenko, M. Sippel, G. Gold, K. Helmreich, M. Ankenbrand, N. Urban and A. Franke, "Impact of Surface Roughness on 3D printed SLS Horn Antennas", in Proceedings of the European Conference on Antennas and Propagation (EUCAP), 2018.
  • M. Ankenbrand, M. Scheetz, J. Franke, K. Lomakin, M. Sippel, G. Gold and K. Helmreich, "Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies", in Proceedings of the 2018 13th International Congress Molded Interconnect Devices (MID), 2018.
  • K. Lomakin et al., "Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material", IEEE Transactions on Components, Packaging and Manufacturing Technology, pp. 1-1, 2018.