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Prof. Dr.-Ing. Klaus Helmreich

  • Organisation: Department Elektrotechnik-Elektronik-Informationstechnik (EEI)
  • Abteilung: Professur für Rechnergestützten Schaltungsentwurf (Prof. Dr. Helmreich)
  • Telefonnummer: +49 9131 85-20740
  • E-Mail:
  • Adresse:
    Wetterkreuz 15
    91058 Erlangen
    Raum 03.003


Klaus Helmreich received the Diploma degree in physics focused on test and failure analysis of integrated circuits and Dr. Eng. degree from Friedrich-Alexander University Erlangen-Nu ̈rnberg (FAU), Erlangen, Germany, in 1993. He was with industry as a Technology Specialist, where he was involved in mixed-signal test, device interfacing, and signal integrity characterization. Since 2004, he has been a Professor with the Institute of Microwaves and Photonics, FAU. His current research interests include signal integrity, material characterization, and test

Neueste Veröffentlichungen

  • K. Lomakin, R. Guschlbauer, F. Osmanlic, Z. Fu, M. Sippel, K. Helmreich, C. Körner, M. Vossiek and G. Gold, "3D Printed Copper Waveguides by Selective Electron Beam Melting Process for E-Band", in Proceedings of the EuMW 2019, Paris, Oktober, 2019.
  • I. Lau, A. Hajian, F. Michler, G. Gold, F. Lurz, U. Schmid, K. Helmreich, R. Weigel and A. Kölpin, "Influence of the PCB Manufacturing Process on the Measurement Error of Planar Relative Permittivity Sensors Up To 100 GHz", IEEE Transactions on Microwave Theory and Techniques, vol. 67, no. 7, pp. 2793-2804, Juli, 2019.
  • K. Lomakin, S. Herold, D. Simon, M. Sippel, A. Sion, M. Vossiek, K. Helmreich and G. Gold, "3D Printed Slotted Rectangular Hollow Waveguides", in Proceedings of the IEEE MTT-S International Microwave Symposium, Boston, USA, Juni, 2019., Boston USA, Juni, 2019.
  • G. Gold, K. Lomakin, K. Helmreich and U. Arz, "High-Frequency Modeling of Coplanar Waveguides Including Surface Roughness", Advances in Radio Science, no. 17, April, 2019.
  • K. Lomakin, L. Klein, L. Ringel, J. Ringel, M. Sippel, K. Helmreich and G. Gold, "3D Printed E-Band Hybrid Coupler", IEEE Microwave and Wireless Components Letters, 2019.